WAFERSALES.COM - SMC CO.,LTD.

전체 22

GRADE	PART NO.	DESCRIPTION	QUANTITY (EA)	PRICE
300mm TEST 45nm≤50EA, DSP	12SW22001	◈ Dophant : Boron ◈ RES.(Min~Max) : 1 ~ 50 Ω㎝ ◈ THK.(Min~Max) : 745.0~805.0 ㎛	3,000	USD 65.5
300mm Prime 50nm ≤30EA, DSP	12PS0B301	◈ Dophant : Boron ◈ RES.(Min~Max) : 8 ~ 12 Ω㎝ ◈ THK.(Min~Max) : 760.0~790.0 ㎛	50	USD 85.2
300mm TEST 50nm ≤ 50EA, DSP	12PS0B007	◈ Dophant : Boron ◈ RES.(Min~Max) : 1 ~ 35 Ω㎝ ◈ THK.(Min~Max) : 755.0~795.0 ㎛	175	USD 73.2
300mm Dummy 160nm≤150EA	12SW0B501	◈ Dophant : Boron ◈ RES.(Min~Max) : 1 ~ 50 ◈ THK.(Min~Max) : 745.0~805.0	50	KRW 41,500
300mm Dummy 120nm≤400EA	12SW0C502	◈ Dophant : Boron ◈ RES.(Min~Max) : 1 ~ 100 ◈ THK.(Min~Max) : 750.0~790.0	325	KRW 29,900
300mm Scrap DSP 750㎛	12SW0C601	◈ Inch : 12" ◈ Polishing : DSP ◈ THK (MIN) : 750㎛	800	KRW 12,000 / pcs
200mm Scrap SSP 700㎛	08SW0C602	◈ Inch : 8" ◈ Polishing : SSP ◈ THK (MIN) : 700㎛	1,000	KRW 3,000
150mm(6") Si Wafer 0.3㎛≤10EA, SSP	06SW19002	◈ Dophant : Boron ◈ THK.(Min~Max) : 655.0~695.0㎛ ◈ Surface Finish : Single Side Polished	9999	USD 19.2 / pcs

주메뉴