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제품소개
IMAGE GRADE PART NO. DESCRIPTION QUANTITY (EA) PRICE
300mm TEST
45nm≤50EA, DSP
12SW22001 ◈ Dophant : Boron
◈ RES.(Min~Max) : 1 ~ 50 Ω㎝
◈ THK.(Min~Max) : 745.0~805.0 ㎛
3,000 USD 65.5
300mm Prime
50nm ≤30EA, DSP
12PS0B301 ◈ Dophant : Boron
◈ RES.(Min~Max) : 8 ~ 12 Ω㎝
◈ THK.(Min~Max) : 760.0~790.0 ㎛
50 USD 85.2
300mm TEST
50nm ≤ 50EA, DSP
12PS0B007 ◈ Dophant : Boron
◈ RES.(Min~Max) : 1 ~ 35 Ω㎝
◈ THK.(Min~Max) : 755.0~795.0 ㎛
175 USD 73.2
300mm Dummy
160nm≤150EA
12SW0B501 ◈ Dophant : Boron
◈ RES.(Min~Max) : 1 ~ 50
◈ THK.(Min~Max) : 745.0~805.0
50 KRW 41,500
300mm Dummy
120nm≤400EA
12SW0C502 ◈ Dophant : Boron
◈ RES.(Min~Max) : 1 ~ 100
◈ THK.(Min~Max) : 750.0~790.0
325 KRW 29,900
300mm Scrap
DSP 750㎛
12SW0C601 ◈ Inch : 12"
◈ Polishing : DSP
◈ THK (MIN) : 750㎛
800 KRW 12,000 / pcs
200mm Scrap
SSP 700㎛
08SW0C602 ◈ Inch : 8"
◈ Polishing : SSP
◈ THK (MIN) : 700㎛
1,000 KRW 3,000
150mm(6") Si Wafer
0.3㎛≤10EA, SSP
06SW19002 ◈ Dophant : Boron
◈ THK.(Min~Max) : 655.0~695.0㎛
◈ Surface Finish : Single Side Polished
9999 USD 19.2 / pcs